| Customization: | Available |
|---|---|
| Type: | Rigid Circuit Board |
| Flame Retardant Properties: | V0 |
| Shipping Cost: | Contact the supplier about freight and estimated delivery time. |
|---|
| Payment Methods: |
|
|---|---|
| Support payments in USD |
| Secure payments: | Every payment you make on Made-in-China.com is protected by the platform. |
|---|
| Refund policy: | Claim a refund if your order doesn't ship, is missing, or arrives with product issues. |
|---|
Suppliers with verified business licenses
Audited Supplier Audited by an independent third-party inspection agency
| Design Features | 2024 | Special process design |
| Number of floors (maximum) | 24L | 1 2 3 4
1.Embedding copper ingot
2.Grading goldfinger 3.High frequency high speed material mixed pressing 4.Control deep drilling and back drilling |
| Maximum plate thickness | 6.0mm | |
| Minimum plate thickness | 0.25mm | |
| Inner layer copper thickness | 1/3~4oz | |
| Outer copper thickness | 1/3 ~6oz | |
| Minimum Through Hole | 0.15mm | |
| Min. blind hole (laser drilled) | 0.05mm | |
| Minimum buried holes | 0.1mm | |
| Through-hole plating aspect ratio capability | 16:1 | |
| Plated filled hole aspect ratio capability | 1:1 | |
| Minimum line width/spacing of inner layer | 50/50μm | |
| Minimum line width/line spacing for outer layer | 50/50μm | |
| Minimum BGA PAD | 0.2mm | |
| Minimum BGA pitch (centre) | 0.40mm | |
| Impedance control accuracy | ±10% | |
| Plated hole filling Dimple≤ | 10um | |
| Maximum Patchwork Size (Mass Production) | 610mm*720mm | |
| Surface Finish | Immersion Gold / Immersion Tin / Immersion Silver / Gold Plating / Lead Free Tin Spraying / OSP / Immersion Gold + OSP | |
| Soldermask Colour | Solder resist silkscreen: green, matte green, red, yellow, blue, black (matte black, glossy black), white Low pressure spraying: green |
| Material class | Key parameter | Material type Brand supplier Panasonic/Rogers/Shengyi/Guoneng/Ruilong/Zhongying/Lianmao/Taiguang/South Asia/Ultrasound/Taiyao |
| PTFE Series | - | R03003 AD300C Taconic RF30-7H RF-35 SG3300/GF300/GF255/SG7350D/SG7350D2 /mmWave77 GNC3304/GN300BP ZYF300CA ZYF220D RA300 RNP280 RP220 |
| PPO Series | - | AeroWave300/mmWaveG |
| Hydrocarbon Series | - | RO4730 RO4003C RO4350 RO4534 RO4535 ZYC8300 RT350B LNB33 /LNB33C/ S7136H /S7136D IT998/E EM892K/K2 |
| Extremely low loss | DF<0.002 | (M8N)R-5795N TU943N/R Synamic9GN/GN2 |
| Ultra Low Loss | 0.004≤ DF<0.002 | (M7N)R-5785N/GN Synamic8GN /Synamic8G /Synamic6N EM890K EM891K TU933+ TU883ASP IT988GSE |
| Ver y Low Loss | 0.006≤DF<0.004 | (M6)R-5775/G/N Synamic6/GX IT968/G /SE IT988G EM528/K EM890 EM891 TU883/C/A TU885 |
| Low loss | 0.009≤DF<0.006 | (M4)R-5725/S S7439 S7439G S7439C SDI06K IT150DA IT170GRA2 IT958G EM526 EM888/S EM888K TU872LK TU872SLK TU863+ TU872SLKSP |
| Mid loss | 0.018≤DF< 0.009 | (M2)R-1577 EM828G EM370(D) EM390 TU862HF TU865 S7040G S7045G SML02G(X) IT150GS IT170GRA1 IT170GT |
| FR4 | CAF | S1150G S1000H Autolad1 S1000-2M Autolad2G Autolad3 Autolad1G Autolad3G IT150G IT158 IT180A IT180I NP155F NP175F NPG151 GW1500 GW1700-1 GW2000-1 GW3000A |
| Design Features | 2024 | 2024 |
| Material specification | FCCL 12-50um (Electrolysis/calendering) | - |
| Covering film 12-50um (Yellow/Black) | - | |
| Low-flow glue PP 40-100um | - | |
| RF layer number | Number of floors | 10L |
| Total plate thickness | Thickness | 0.25-2.0mm |
| Copper thickness | Inner & Outer layers | 1/4-2OZ |
| Surface treatment | Processing mode | - |
| Line width/line distance (minimum) | Face copper thickness =36 | 70/70μm |
| Aperture /Pad(min) | Mechanical drilling PTH | 100μm/300μm |
| Laser drilling Via | 50μm/200um | |
| impedance | Impedance specification | 10% |
| Solder resist | Alignment tolerance (CCD/DI) | 50um/20um |
| Soft and hard board interface area | Overflow specification | 0.5mm |
| Steel sheet/reinforcement | Fitting tolerance | 150um |
| W/B zone | Flatness (front/back) | 20um/30um |
| Appearance | Forming tolerance | 150um |
Q1.Are you trading company or manufacturer ?
A: We are manufacturer with a separated factory.
Q2.What do I need to offer for production?
A: Basiclly PCB Gerber file and BOM list, if you have other requirement,just let us know?
Q3.What is your minimum order quantity?
A: Our MOQ is 1 PCS.
Q4.What is needed for quotation?
A: PCB : Quantity, Gerber file and Technic requirements(material, surface finish treatment, copper thickness, board thickness )
PCBA: PCB information, BOM, (Testing documents)
Q5.What file formats do you accept for production?
A: Gerber file: CAM350 RS274X
PCB file: Protel 99SE, P-CAD 2001 PCB
BOM: Excel (PDF,word,txt)
Q6.Are my files safe?
A: Your files are held in complete safety and security. We protect the intellectual property for our customers in the whole process.
All documents from customers are never shared with any third parties.
Q7.MOQ?
A: There is no MOQ. We are able to handle Small as well as large volume production with flexibility.
Q8.Shipping cost?
A: The shipping cost is determined by the destination, weight, packing size of the goods. Please let us know if you need us
to quote you the shipping cost.
Q9.Do you accept process materials supplied by clients?
A Yes, we can provide component source, and we also accept component from client.
){kind=link}